Advanced Cooling Technologies - HiK Card Guides





HiK™ Card guides provide improved thermal performance over traditional metal chassis assemblies.   In sealed ruggedized electronics chassis, heat is dissipated from the boards to the chassis through a wedge-lock joint inside the chassis walls.  This heat is conducted through the chassis walls and is dissipated to an air or liquid cooled heat sink.In many designs, such as non-uniform power in various slots or in bottom mounted cold plates, conduction within the chassis walls is a significant resistance in the overall system design.  These issues can be easily overcome by integrating heat pipes into the aluminum structures.

For air cooled systems, heat pipes isothermalize the card guide allowing higher fin efficiency for forced air or natural convection heat dissipation. ACT will work with customers for optimized fin geometry and heat pipe layout.In liquid cooled systems, the coolant is typically located at the base of the chassis for reliability concerns. This can lead to large conduction gradients, making a HiK™ solution very effective.  The heat pipes move heat directly to the liquid plate with minimal temperature rise. To avoid any redesigns, ACT offers this solution as an External Bolt-On HiK™ Plate in addition to an integrated card guide design.

The External Bolt-On HiK™ Plate can be attached to the current chassis to reduce temperature rise. The Figure below shows an example of the performance increase changing from aluminum to a bolt-on HiK™ plate.

In addition to the thermal performance enhancements, HiK™ solutions in card guides also offer significant weight saving opportunities. In the analysis photo above, to achieve similar performance as the HiK™ solution with aluminum you would need to add nearly 2” of thickness and over 5 lbs of weight!

MOOG-Protokraft Excalibur 10Gb Ethernet Transponder


Moog Protokraft Excalibur series optical fiber transponders consist of optoelectronic transmitter and receiver functions integrated into a bulkhead mounted MIL-DTL-38999, series III receptacle connector along with the 10 Gbps / XAUI SerDes functions. The optical transmitters are 850 nm VCSEL lasers. The optical receivers consist of PIN and preamplifier assemblies and limiting post-amplifiers. The XAUI electrical interface to the Excalibur series optical fiber transponders is a Samtec controlled impedance connector enabling interface to a ribbon coax cable or flexible printed circuit assembly.
Excalibur series optical fiber transponders are vibration isolated, environmentally hardened components designed for use in harsh environment applications.

Features

1x or 2x XAUI to 10 G Base-SR transponder ports in a rugged metal housing with D38999 interface
D38999 size 17-08 or 11-02 shell with up to 8x MIL-T-29504 / 04 multimode or singlemode fiber optic contacts
Compact size and light weight (< 8 oz) for simple mounting and installation
10 Gigabit Ethernet optical fiber link distances up to 300 meters
Operating temperature range from -40°C to +85°C
Shock, vibration and immersion resistant per MIL-STD-810
Olive drab cadmium, nickel and zinc-nickel plating meets stringent corrosion resistance performance specificationsAluminum housings are strong, durable and light weight
Samtec EQCD Series electrical connector for SMT interface
Applications
Civil and military vehicle networking
10 Gigabit Ethernet network switches, NIC's and many other applications
Data communication links up to 20 Gbps in one connector
VPX backplane extension

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